Recently, the GCC Open AI Infra Community successfully held a closed-door technical seminar on next-generation computing infrastructure in Beijing. Nearly 100 technical experts and community members attended the seminar, including leading internet users and representatives from major next-generation computing infrastructure companies such as Ruijie Networks, H3C, Molex, Amphenol, Huawei, Delta, Great Wall Power Supply, VNET, Envicool, and Shenling.

As AI computing power continues to upgrade at an accelerated pace, the power density of a single rack is rapidly increasing from the traditional level of 20–30kW to several hundred kW, quickly approaching 1MW and likely to move beyond that threshold. This trend is not only reshaping the underlying architecture of chips and servers, but also placing disruptive new requirements on computing infrastructure, including power supply and distribution, high-speed interconnection, and liquid cooling.

The GCC Open AI Infra Community has continued to focus on frontier technology areas such as MW-level computing systems, GW-level data centers, high-speed interconnection, 800V high-voltage direct current (HVDC) power supply, advanced liquid cooling, and intelligent operations and maintenance. To address the core technical bottlenecks in computing cluster deployment, the community convened this seminar, which received strong support from community members and industry experts.

The seminar was moderated by Zhang Guangbin, Secretary-General of the GCC Open AI Infra Community and Founder of Yiqi Research Institute. Experts from the community and participating companies delivered keynote presentations and joined Q&A discussions across several areas, including demand analysis, computing units, high-speed interconnection, power supply and distribution, and cooling technologies. Together, they explored the systematic challenges and technical breakthrough paths facing megawatt-level computing systems and gigawatt-level data centers.

The successful convening of this seminar was highly recognized by participating experts and corporate technical representatives. Discussions on key industry topics will be further consolidated into shared consensus and released to community members and the public. This also reflects the working objectives of the GCC Open AI Infra Community, as well as its values of “demand definition, open sharing, and collaborative innovation.”

Since its establishment, the GCC Open AI Infra Community has efficiently advanced the development of four major project groups: AI rack-scale systems, data center infrastructure, board cards & components, and benchmarking. Through collaborative innovation, the community is promoting the implementation of technical specifications and accelerating the development of an open, agile, and sustainable AI computing infrastructure ecosystem.

Within just a few months of its founding, the community has already released a number of important achievements. These include the GCC Liquid-Cooled Rack-Scale System Architecture Design Specification — Type A and the AIDC Infrastructure Specification, both recently released by community project groups for feedback from community members and the public. These outputs demonstrate the efficiency, openness, and collaborative nature of the GCC Open AI Infra Community.

Going forward, the GCC Open AI Infra Community will continue to promote technical collaboration in the field of AI infrastructure and further facilitate co-creation across the full value chain of intelligent computing centers in an open manner.

The GCC Open AI Infra Community also announced that the 2026 Open AI Infra Community Conference will be held in Beijing this April. Focusing on supernodes and core technologies for next-generation computing infrastructure, the conference will feature several vertical forums, including the Megawatt-Level Computing Systems Forum, High-Speed Interconnection Forum, 800V Power Supply and Distribution Forum, New Liquid Cooling Technologies Forum, Supernode Components Forum, and Supernode Performance Benchmark Forum. These forums will provide a platform for more in-depth and detailed exchanges.

Stay tuned for the latest updates on the conference and contact the organizing committee for participation details. This April in Beijing, we look forward to joining industry partners in building a new ecosystem for intelligent computing.