The meeting focused on improving the collaborative adaptation between DPUs and core components such as native liquid-cooled board cards and servers, with the goal of promoting the large-scale deployment of fully liquid-cooled computing systems. Participants held in-depth discussions on key technical topics, including DPU compatibility, interconnection, and interoperability standardization.
As the first project group launched under the Board Card & Component Project Group of the GCC Open AI Infra Community, the DPU Project Group will develop relevant technical specifications to connect the collaborative scheduling chain of DPUs and fully unlock the core value of DPUs in enhancing the communication efficiency of AI computing clusters.
Guided by the GCC Open AI Infra Community’s values of “open sharing and collaborative innovation,” the DPU Project Group welcomes more companies and professionals to participate.
To join the project group, please contact Ms. Chen from the Community Secretariat at chenhuaijing@gccorg.com, or scan the QR code to apply.
At the upcoming 2026 Open AI Infra Summit, the DPU Project Group and the GCC Open AI Infra Community will jointly release a series of specifications in the field of AI infrastructure, co-created by community members. These efforts aim to build a comprehensive specification system tailored to computing infrastructure scenarios in the AI era.
The 2026 Open AI Infra Summit will be held from April 9 to 10 at the Renaissance Beijing Capital Hotel. Under the theme “Open Innovation and Collaborative Win-Win: Building an Intelligent Computing Infrastructure Ecosystem,” the summit sincerely invites industry partners to gather in Beijing, embark on a new journey of computing infrastructure development, and jointly explore the future evolution of computing facilities in the AI era.
Let us co-create the future of open AI infrastructure, and we look forward to meeting you at the 2026 Open AI Infra Summit.
High Performance Computing Development Group(HPC DG) 
