As artificial intelligence continues to develop rapidly, data centers have become a critical foundation supporting the industry’s next stage of growth.

For many leading internet companies and cloud service providers, improving the construction and operational efficiency of intelligent computing centers has become a key objective.

How can the industry quickly meet the needs of hyperscale customers, enterprise users, and technology providers across the value chain?

How can data centers respond to the growing demands for energy efficiency, power supply capacity, and cooling density?

The answer lies in openness, collaboration, and the open-source practices and standardization that follow.

In the relatively fragmented field of liquid cooling, standards and collaboration are needed across the full chain, from components such as cold plates, working fluids, valves, and quick connectors, to technical specifications for inspection, testing, and maintenance.

Even in areas where collaboration has traditionally been stronger, such as storage, servers, networking, and racks, the industry still needs greater openness, collaboration, and standardization at a larger scale.

This is also one of the key reasons why the GCC Liquid Cooling Committee has been upgraded into the GCC Open AI Infra Community.

This upgrade not only expands the committee’s work scope and service targets from liquid cooling to the entire data center sector, but also introduces more detailed technical specifications in addition to the existing standards system. These specifications will provide more practical guidance for opening up data center-related products, enabling members to participate more flexibly and accelerating product iteration.

From the GCC Liquid Cooling Committee to the GCC Open AI Infra Community, this evolution marks a shift from openness to greater openness, and from openness to more collaborative openness.

Only through this approach can AI infrastructure achieve full-stack collaboration across chips, racks, cooling, refrigeration, power supply, and the broader data center system. It is also the only way to promote collaborative innovation across the entire industrial chain through open co-creation.

Since the official establishment of the GCC Open AI Infra Community at the end of October 2025, its four major project groups have held multiple rounds of discussions and have steadily advanced the development of relevant specifications and standards.

To promote broader communication and discussion, and to collect suggestions from a wider range of users, experts, and enterprises, the GCC Open AI Infra Community has announced that the 2026 AIDC Industry Development Conference and Open AI Infra Community Conference will be held in Beijing from April 9 to 10, 2026.

Under the theme “Open Co-Creation and Collaborative Evolution: Building a Full-Stack Intelligent Computing Ecosystem,” the conference will include two main forums: the Open AI Infra Community Conference and the AIDC Industry Development Conference.

It will also feature several vertical forums focusing on core technologies for intelligent computing infrastructure, including Megawatt-Level Computing System Technologies, 800V Power Supply Technologies, the Liquid Cooling “Dual-Zero Initiative,” the Supernode Components Forum, and the Supernode Performance Benchmark Forum.

To showcase innovative achievements by ecosystem companies in the field of intelligent computing infrastructure, the conference will also set up a dedicated exhibition area. Community members and industrial partners are invited to participate and present frontier technologies, mature solutions, and innovative products.

A special “Technology Co-Creation Corner” will also be established within the exhibition area to create an immersive and interactive communication space, helping to efficiently connect supply and demand sides.

Interested in discussing breakthroughs in supernode architecture and green computing practices with industry leaders?

Want to experience core intelligent computing technologies and innovative products up close?

Stay tuned for the latest conference updates and contact the organizing committee for participation details. This April in Beijing, we look forward to joining you in building a new ecosystem for intelligent computing.

Contact

Miss. Wang

Email: wanghaifeng@gccorg.com