The global artificial intelligence (AI) industry continues to evolve at a rapid pace, and computing infrastructure is undergoing structural transformation. As hundred-kilowatt-per-rack deployments scale up and megawatt-scale architectures accelerate into production, computing infrastructure development has officially entered a new era of megawatt-scale adoption and gigawatt-scale planning. The industry has moved beyond single-point hardware optimization: the superpod is emerging as the mainstream form of new computing supply, driving a new pattern of full-stack, coordinated development across the industry.
The Computing Global Conference (CGC) is the flagship annual international industry event hosted by the Global Computing Consortium (GCC). Under the 2026 theme "Megawatt Powers New Infra, Unleashing SuperPoD Computing Power," the conference focuses on building the superpod industrial system and innovating megawatt-scale intelligent computing infrastructure. With forging global industry consensus, co-building computing standards systems, and accelerating the large-scale deployment of AI data centers (AIDC) as its core directions, the conference connects the full chain of collaboration—from underlying infrastructure to intelligent applications across thousands of industries. Leveraging GCC's full-stack AI infrastructure integration capabilities spanning "chip–interconnect–supernode–AIDC," CGC is committed to driving industry consensus on superpods, laying a solid computing foundation for AI-era industrial innovation, and building an open, win-win global computing industry ecosystem.
As a key concurrent event of the Consumer Electronics Innovation Conference (CEIC) 2026, CGC2026 will be held in Shenzhen from October 21 to 24, 2026. The conference features a three-dimensional content matrix of "1 main forum + 5 specialized sub-forums + 1 themed exhibition," gathering academicians, industry leaders, and technology decision-makers from around the world. Organized around four dimensions—Strategic Leadership · Global Foresight, Industry Insights · Trend Analysis, Scenario Deep-Dive · Technology Innovation, and Industry Action · Ecosystem Co-building—the conference will provide forward-looking industry assessments, share cutting-edge technology achievements, release authoritative standards and specifications, and showcase benchmark practices, striving to serve as the year's leading platform for the computing industry—integrating trend guidance, technology innovation, standards co-building, and ecosystem collaboration.
Main Forum: Computing Global Conference 2026 (CGC 2026)
Theme: Megawatt Powers New Infra, Unleashing SuperPoD Computing Power
Date: October 21, 9:00–12:00
Venue: Bougainvillea Hall, 5F, Shenzhen Convention and Exhibition Center
Description: As the centerpiece of CGC2026, the Main Forum is organized around four dimensions—Strategic Leadership · Global Foresight, Industry Insights · Trend Analysis, Scenario Deep-Dive · Technology Innovation, and Industry Action · Ecosystem Co-building. Against the backdrop of computing power entering a new phase of megawatt-scale adoption and gigawatt-scale construction, the forum presents a comprehensive showcase of technology breakthroughs and industry empowerment value—spanning cutting-edge industry and technology assessments, breakthroughs in core application scenarios, and the release of the consortium's major annual achievements. By solidifying industry foundations through tangible outcomes and activating development momentum through value sharing, global computing leaders, top experts, and ecosystem partners will gather to witness the year's defining moment for the global computing industry and chart the technology pathways and development directions for industrial innovation.
Sub-Forum 1:Open AI Infra Technology Forum
Theme:Driving SuperPoD Architecture Innovation and Jointly Exploring Pathways to GW-Scale AIDC Deployment
Date: October 21, 14:00–17:00
Venue: Chrysanthemum Hall, 5F, Shenzhen Convention and Exhibition Center (Futian)
Description:Bringing together experts from across the AI infrastructure ecosystem, the forum will explore SuperPoD and GW-scale AIDC technologies, including high-speed interconnects, compute-storage synergy, liquid cooling, and 800V HVDC power systems. It will also address high-density computing cluster deployment, energy efficiency, and standards development, accelerating the large-scale advancement of AI computing infrastructure.
Sub-Forum 2:SuperPoD Technology & Ecosystem Forum
Theme:Forging New Tracks for Intelligent Computing, Unleashing High Potential of Computing Power
Date: October 21, 14:00–17:00
Venue: Peony Hall, 5F, Shenzhen Convention and Exhibition Center (Futian)
Description:Focusing on SuperPoD technology frontiers and industry practices, the forum gathers industry and research experts from various fields, including standard, system, application, chip & component, and computing infrastructure. The forum will present how SuperPoD architecture and technological innovation can break through the computing and communication bottlenecks of traditional products, achieving higher-efficiency large model training and inference as well as large-scale application deployment. Invited speakers will also showcase the latest practical achievements and research progress, explore new opportunities in the SuperPoD era, foster ecosystem synergy for AI infrastructure , and accelerate intelligent computing empowering diverse industries.
Sub-Forum 3:Intelligent Computing Services Technology & Application Forum
Theme: Optimizing Computing Power Lifecycle, Maximizing Token Production Efficiency
Date: October 21, 14:00–17:00
Venue: Rose Hall 2, 5F, Shenzhen Convention and Exhibition Center (Futian)
Description: This forum focuses on computing power lifecycle optimization and Token production efficiency improvement, bringing together industry leaders and ecosystem partners for dialogue on intelligent computing infrastructure development, industrial collaboration, and ecosystem co-building, exploring open, efficient, and sustainable new paradigms for the AI industry.
Sub-Forum 4:Computing Security Ecosystem Forum
Date: October 21, 14:00–17:00
Venue: Lotus Hall 2, 5F, Shenzhen Convention and Exhibition Center (Futian)
Description: As AI large models and AI Agents accelerate into deployment, computing infrastructure security — including cloud computing and supernodes — as well as model security and data and privacy security in agent interactions, face a range of real-world challenges. Technologies such as Confidential Computing, Privacy-Preserving Computing, Encrypted-State Computing, Trusted Computing, and Quantum Cryptography have emerged as key means to address these risks. The Computing Security Ecosystem Forum focuses on industry pain points, shares application practices, and jointly explores pathways for high-quality development of the computing security industry.
Sub-Forum 5:openUBMC Technology Ecosystem Forum
Theme:Breaking Boundaries, AI-Enabling — Defining the Next-Generation BMC
Date: October 21, 14:00–17:00
Venue: Rose Hall 1, 5F, Shenzhen Convention and Exhibition Center (Futian)
Description:As AI compute clusters are rapidly deployed, new‑generation computing hardware including super‑nodes and GPU‑BOX continues to emerge, raising new requirements for open and intelligent BMC management. This forum focuses on next-generation BMC management technology evolution, with in-depth discussions on northbound self-access, southbound standardization, AI agents, and other core topics. Relevant standards and reference implementations will be released on-site. Joining hands with industry leaders and technical experts, we aim to reach consensus on BMC standards and empower enterprises to adopt a new paradigm of open, intelligent and autonomous compute management.
High Performance Computing Development Group(HPC DG) 
