As the parameter count of large AI models enters the trillion scale, AI applications have fully entered the "Year of Explosive Inference Implementation", and the whole-link requirements from training to inference make the comprehensive transformation of AI Infra inevitable.

The leapfrog evolution of AI Infra has not only reshaped the underlying architectures of chips and complete machines but also imposed disruptive technological requirements on computing power infrastructure such as power supply and distribution, high-speed interconnection, and liquid cooling heat dissipation,ultra-low latency high-speed interconnection, 800V high-voltage direct current (HVDC) power supply, microchannel cold plate liquid cooling, integrated delivery of whole racks... have become the core pillars for building the next-generation intelligent computing base.

As the annual grand event of the Open AI Infra Community, the 2026 Open AI Infra Summit closely follows industry trends, focuses on hot topics from megawatt-level computing power systems to gigawatt-level data centers, covers key areas such as high-speed interconnection, 800V high-voltage power supply, advanced liquid cooling, supernode ecosystem, supernode performance testing, etc., precisely addresses the core technical bottlenecks in the clustered deployment of computing power, and helps the industry efficiently break through development dilemmas.

Scan the QR code now to register, join industry elites at the grand event, and jointly create the future of AI Infra through open collaboration. 

Preview of the April 9 Conference

Adhering to the concept of diversified innovation, the 2026 Open AI Infra Community Conference kicked off the core communication sessions of the community series on April 9, including the Community Management Committee Meeting, Community Work Meeting, Work Meetings of Each Project Group, Closed-door Meeting on the Deep Integration of AI Computing Power and Storage, and OAII Night, which laid a solid foundation for collaboration and rallied consensus on development for the entire conference.

Preview of the Main Forum Topics on the Morning of April 10th

1. Highlights of the Main Forum of the 2026 Open AI Infra Summit

Multiple significant achievements of the community were released in a concentrated manner, with joint technical sharing by leading users and industrial partners from the chip to computing power systems and then to the Data center industry, covering the entire computing power industry chain, combining ecosystem collaboration and incentives to drive the innovative development of the industry.

2. Invited guests and topics:

Community Achievements | Key Achievements Released Collectively to Improve the Technical Specification System of AI Computing Power

Guided by the core concept of "Open Innovation, Collaborative Win-Win", the OAII Community has completed the release of multiple core achievements and the improvement of its organizational structure. Zhang Chun, the Chairman of the Community Management Committee and the Manager of the Development Planning Division of the Digital Intelligence Department of China Mobile Group, provided in-depth interpretations of the community's founding structure and vision, and jointly released the community's multi-type specification achievements with the two Co-Chairmen of the Community Technical Steering Committee, Yu Xiongjie from ByteDance and Xu Shuisheng from Huawei Computing. Additionally, they announced the AIDC Model Site Lighting Plan based on the implementation of community specifications to meet the rapid iterative needs of technologies in the AI era.

Frontier Exploration | In-depth Discussion on Megawatt-level Computing Power Systems to Gigawatt-level Data Centers, Initiating Specialized Technology Exploration

The community has always maintained insight into and practice of cutting-edge technologies. Gao Xiaojun, Co-Chair of the Community Management Committee and from ByteDance, Long Pan, Vice President of R&D of Huawei Computing Product Line, Jing Tangbo, a member of the Community Technical Steering Committee and from ByteDance, and other Subject-Matter Experts shared insights on the technological trends, challenges, and community technology exploration plans of megawatt-level computing power systems, while discussing the technical difficulties of gigawatt-level Data centers, and held the launch ceremony of the megawatt-level computing power system, marking that the community's technological exploration in the field of ultra-large-scale computing power systems has entered a new stage.

Technical Practice | Intensive implementation of technological achievements, setting a benchmark for industry innovation

Two members of the Community Management Committee, Chen Guofeng, Senior Director of JD Cloud, and Yan Kun, Vice President of 21Vianet, will respectively share the practices of liquid cooling technology, the technical solutions of AIDC liquid-cooled data centers, and the implementation results of demonstration sites. Meanwhile, the community will present the GCC-Open AI Infra Community Annual Innovation Pioneer Award to recognize entities that have made outstanding contributions to the AI computing power ecosystem, setting a benchmark for the innovative development of the industry.

Deep Collaboration | Whole-Link Technology Exploration | Open Co-Creation of a New Future for AI Infra

In addition, industrial chain partners who have made outstanding contributions and won the community's annual awards in 2025 will conduct discussions around technological directions such as Gigawatt-level AIDC, Open Computing AI Supernode Architecture, Liquid Cooling Technology Innovation, and Next-generation XPU Modules carried out within the community, promoting the integration of AI computing power technologies.

 

Preview of the Topics of the Six Thematic Forums on the Afternoon of April 10th

High-Speed Interconnect Forum

 

Undertaken by: High-Speed Interconnection Project Team of OAII Community AI Rack Project Group

Highlights of the 2026 Open AI Infra Summit High-Speed Interconnection Theme Forum: Focusing on new directions in the core areas of ultra-low latency electrical and optical interconnection, conducting in-depth sharing around multi-dimensional aspects of opto-electrical-protocol, exploring the Application Areas of high-speed interconnection, and providing multi-dimensional references for the development of high-speed interconnection technology for AI supernodes.

The following is a preview of the invited keynote speakers and topic directions (subject to the subsequent official agenda):

Senior System Engineer of Baidu Smart Cloud, Wu Zhenghui, Leads AI Infra Innovation with Tianchi Supernode

Huawei Lingqu System Expert, Lingqu Interconnection Protocol, and Supernode Application

Jia Gongxian, Director of Molex System Architecture, Analysis of the Trends in AI Supernode Electrical Interconnection Architecture

Qiu Yudi, High-Speed Interconnect Architect at Alibaba Cloud, Breaks Through the Bottlenecks in the Future Development of Scale Up: UALink Protocol Evolution and Optoelectronic Convergence

Anfei Nuo Technology Expert Wu Guoji's Exploration of the Future of Copper-based Interconnection in the AI Era

Qinghong Electronics - Fae Director Chen Xuanhao's Practice and Reflection on the 224G High-Speed Interconnection System Solution for Super Nodes

Huawei Optical Interconnection Technology Expert Sun Xiaobin Exploration and Practice of Supernode Optical Interconnection Technology

Luxshare Technology Expert Jin Long 224G and 448G Interconnection Solutions

Huagong Technology Technical Expert: Interpretation of Optical Engine Technology and Implementation Practice

 

800V HVDC Supply and Distribution Forum

 

Co-organizer: China Third Generation Semiconductor Industry Technology Innovation Strategic Alliance

Undertaken by: AI Whole Rack Project Group Power Supply Project Team, Data Center Infrastructure Project Group Data Center Power Supply Project Team

By pooling the strength of the industrial chain, partners from the whole-link industrial chain including industrial parks, data centers, whole racks, systems, and chip ends will discuss the power supply and distribution challenges in the AI era, domestic and international technical routes, industrial chain collaboration, architecture evolution, scenario practice, and bottleneck resolution, aiming to create highly reliable and efficient power supply and distribution solutions for megawatt/gigawatt-level computing power systems.

The following is a preview of the invited keynote speakers and topic directions (subject to the subsequent official agenda):

Yang Fuhua, Vice Chairman and Secretary General of the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance, delivers a speech

Team Leader of the Power Supply Project Group of the AI Whole Rack Project Cluster, System Engineer at Baidu Smart Cloud, Cheng Bing, Exploration of the Power Supply Architecture of the OAII Community Power Supply and Distribution Project Group in the OAII Community

Community Management Committee Member, R&D Head of Kuaishou Data Center Li Dianlin: Requirements of High-Density Computing Power System for HVDC

Zhao Chengtao, Director of the Data Center Infrastructure Solutions Department of Vertiv China, Evolution Path of 800V DC Power Supply Architecture in Data Centers

Liu Peiguo, Co-leader of the Community Data Center Power Supply Project Team and Chief Technology Expert at Huawei Data Center Energy, adapts the 800V DC power supply system for AIDC

Ma Lisha, Market Manager of Schneider Electric's Data Center Industry, Changes and Considerations Faced by DC Protection from 240V HVDC to 800V HVDC/SST

Yan Han, Vice President of the Product Innovation Center of GDS, 800V HVDC under the Dual Carbon Goals: From Energy Efficiency Revolution to Sustainable Computing Infrastructure

ByteDance Technical Engineer He Jialong: Bottlenecks and Development Directions of the Power Supply System within the Whole Cabinet

Discussion on the 800V to 12V Solution by a Technical Expert from Hyper Fusion Digital Technologies Joint Stock Company

Han Longfei, CTO of the Advanced Power Supply Division of Shenzhen Megmeet Electric Co., Ltd., Discussion on Challenges and Solutions of 800V Power Supply and Distribution System

Li Yan, Director of Great Wall Power Supply R&D and Head of Beijing R&D Center, Challenges in PSU Brought by Megawatt-level Computing Power Systems

Hu Doudou, Application Expert of Silan Microelectronics System, Computing Power Engine · Power Leadership | Silan Micro AI Server Power Full-Chain Power Semiconductor Solution

Member of the Community Management Committee, Director of the Data Center Infrastructure Project Group, Data Center Division of China Electronic Engineering Design Institute, Wang Zhiqiang, 800V Engineering Design of the Intelligent Computing Center

 

Full Stack Liquid Cooling New Technology Forum

 

Organizer: Double Zero Action Special Project Team, OAII Community AI Rack Project Group - Cooling Project Team, Data Center Infrastructure - Data Center Liquid Cooling Team

Covering all aspects of the entire industrial chain of liquid cooling technology, comprehensively exploring and innovating from basic materials, core technologies to system architecture, directly addressing the core pain points of high-density computing power heat dissipation, setting the tone for the innovation and implementation direction of liquid cooling technology, focusing on liquid cooling technology innovation, scenario implementation practice, and safety assurance of the dual-zero initiative to conduct all-dimensional discussions, and achieving in-depth linkage between the technology R&D end and the user demand end.

The following is a preview of the invited keynote speakers and topic directions (subject to the subsequent official agenda):

Jin Yuehong, Team Leader of the Cooling Project Group of the OAII Community Rack Project Cluster, Management Team of the Double Zero Initiative, and JD Cloud Technology Expert, Collaborates to Break Through Barriers and Advance Liquid Cooling - OAII Community Liquid Cooling Technology Innovation and Implementation Initiative

Technical Sharing on Cold Plate Liquid Cooling Leakage Protection System by Leng Banshi, Technical Expert of the Digital Intelligence Department of China Mobile Group

Ming Liang, Director of Huawei Micro Module and Thermal Management Products, AI-Enabled High-Quality Liquid Cooling System Enables the AI World to Operate Steadily

Li Xinqi, Product Director of Envicom IDC Business Unit, AIDC Liquid Cooling Technology Trends, New Technologies, New Architectures

Senior Expert of Yuantu Future Liquid Cooling Technology, Wu Zhenhua, Innovative Practice and Breakthrough of Supernode Liquid Cooling Technology under the New Generation of AI Computing Power

Cao Weibing, HVAC Expert of CenturyLink DC R&D & Product Department, Overall Architecture and Application of Waterless Liquid Cooling

Tian Feng, General Manager of Chaoyun Digital Internet and AIDC Business, Shares AI Inference Diversified Liquid Cooling Practice

Wang Rui, Director of the Radiator Division of Ningbo Shengjiu Technology, Two-Phase: Exploration of Key Technological Breakthroughs in Liquid Cooling and Monetization Application Paths

Dr. Huang Yuanfeng, Director of Technology Development at Shuguang Digital Innovation, Shares Key Technologies of MW-Class Supercluster Liquid Cooling

Yu Rongdong, Technical Director of Aesop Temperature Technology (Dalian) Co., Ltd., Liquid Cooling Fault Detection and Fault Alarm System

 

Supernode Ecosystem Forum

 

Undertaken by: OAII Community Server Node Incubation Group, Board & Component Project Group DPU Project Team

Focusing on the three core directions of AI computing power technology innovation, hardware upgrade, and protocol interconnection, it conducts comprehensive technical exploration across all aspects of the supernode's entire industrial chain, including computing power, storage, and network, from core hardware, interconnection protocols to firmware adaptation, based on the actual needs of Internet users, providing technical references and practical paths for building a complete AI computing power ecosystem.

The following is a preview of the invited keynote speakers and topic directions (subject to the subsequent official agenda):

Chen Jun, Team Leader of the OAII Community DPU Project and Technical Expert at ByteDance, Exploration and Practice of New Technologies in the OAII Community DPU Project Team

Development Trends and Application Challenges of Ruijie Networks' XPU Module

Challenges and Key Points of Future Development in AI Storage by Yangtze Memory Technologies Expert

Why CXL/UALink Is the Future of AI Storage Scale-Up Interconnect, According to Alibaba Cloud Technical Experts

Technical Discussion on the New Generation of SSDs on Supernodes by Weng Yun, Technical Director of Solidigm Asia-Pacific Region

Xingyin Information Technology (Shanghai Co., Ltd.) Rednote Technology Expert Decodes the Infrastructure Implementation Behind Hundreds of Millions of Traffic

Huawei Technology Expert Bao Yunbing Details the Development Trends of UB-EXP

Wu Xiaojun, Product Manager of Lingda Technology (Tianjin) Co., Ltd., New Generation Network Card Technology Development Trends for Supernodes

Singular Moore Network Architecture VP Ye Dong AI Native Era: Intelligent Computing Interconnection Solution Based on Scale Out and Scale Up Networks

Huawei Computing Technology Expert: Technical Exploration and Practice of Firmware in Supernodes

 

GW-level AIDC Forum

 

Undertaken by: OAII Community Data Center Infrastructure Project Group

Focusing on the top-level design, technology implementation, implementation path, intelligent operation and maintenance, and ecosystem co-construction of gigawatt-level AIDC, it provides targeted solutions for key pain points such as cooling, power supply, and engineering design under high-density computing power, and offers references for the construction and efficient operation of gigawatt-level AIDC.

The following is a preview of the invited keynote speakers and topic directions (subject to the subsequent official agenda):

Director of OAII Community Data Center Infrastructure Project Group, Huawei Technology Expert Cai Zhiping, Project Planning for OAII Community - Data Center Infrastructure Project Group

ByteDance Technical Expert Zhao Zheng: Exploration of Power Challenges and Solutions for GW-level AIDC

Sun De, Senior Architect at Shenling Environment Data Center, High-quality Construction of GW-level Liquid Cooling Solutions

JD Cloud Technical Expert: Requirements and Practices of JD Cloud AIDC Data Center

Xi Xingjian, General Manager of the Industrial Domain of Huawei Data Center System Integration Services, Huawei FusionBlock-AIDC -- Building a Smart Cube Architecture with Flexible Adaptation from Source to Management to End, Jointly Building an Intensive, Green, and Sustainable New AI Infrastructure

CenturyLink Technology Experts: CenturyLink GW-level AIDC Technology Challenges and Solution Practices

Tang Hu, Vice President & Chief Technology Officer of GLP Data Center, Exploration of GLP Green New Energy AIDC

China Telecom Technology Expert Guo Cong: The Path of Technological Evolution and Design of AIDC Infrastructure in High-Density Computing Scenarios

Liu Tao, Team Leader of OAII Community DC Intelligence and Technical Director of GDS, Shares Practical Experience in Intelligent Operation and Maintenance of AIDC Liquid-Cooled Data Centers

Haier Air Conditioning Technology Expert Cold Station Cold Source Heat Recovery

 

Supernode Evaluation Forum

 

Organizer: OAII Community Benchmark Project Group, Computing Product Performance Benchmark Working Group, AI Sub-Technical Committee of the Beacon Committee, and AI Performance Benchmark Special Committee

By pooling the strengths of multiple parties, including operators, cloud providers, chip enterprises, standardization research institutes, etc., and closely adhering to the core logic of "load - system - chip", it achieves whole - link coverage of super - node performance evaluation, providing core references for establishing a standardized system for super - node performance evaluation and promoting the optimization and upgrading of technology.

The following is a preview of the invited keynote speakers and topic directions (subject to the subsequent official agenda):

China Mobile Research Institute: Benchmark Testing and Tuning Practices for China Mobile's Ultra-Large-Scale Intelligent Computing Capability

Tianyi Cloud Technology Co., Ltd. Huang Tao Sharing of Excellent Practices and Performance Benefits of Typical Scenarios of Tianyi Cloud Computing Super Node

Research Progress and Application Scenario Interpretation of ClusterBench, a Supernode Performance Benchmarking Tool Developed by China Electronics Standardization Institute and Chen Haitong

China National Institute of Standardization Ding Qing Introduction to the Implementation of GB Standards and Energy Efficiency Labels for Server Energy Efficiency

Huawei Cloud Service Co., Ltd. Yu Zhibin Practice Sharing of Huawei Cloud Shuhai Benchmark in the Field of Chip and Supernode System

Sharing of Practical Experiences in the Benchmark Field of Inspur Supernodes and Computing Performance by Inspur Information Technology Experts

Optimization Analysis of the Computational Performance Benchmark Bottleneck of XuanTie Processor of Pingtouge Semiconductor Co., Ltd. for CPUBench

 

Collaborate with the Open AI Infra Community to Openly Co-create a New Future for AI Infra

Innovate collaboratively, gather strength to move forward, and scan the QR code now to register for the 2026 Open AI Infra Summit.

April 9-10, Beijing Ritz-Carlton Hotel. We invite you to join the grand feast of computing power ecosystem.

 

(end)