The 2026 Open AI Infra Summit, guided by the Global Computing Consortium (GCC) and hosted by the GCC-Open AI Infra Community, is scheduled to take place on April 9-10, 2026 in Beijing. The theme of the conference is "Open Innovation, Collaborative Win-Win: Building the Intelligent Computing Infrastructure Ecosystem."

Currently, artificial intelligence technology has entered a new phase of rapid iteration. The "model frenzy" during the Spring Festival has focused the industry's attention on the core breakthrough points for AI Infra in 2026: How to solidify the performance foundation with high-density computing power? How to achieve extreme efficiency with super-node architecture? How can high-speed interconnect (optical/electrical) enable low-latency, high-bandwidth transmission for computing clusters? Does 800V HVDC power distribution and supply reconfigure energy utilization systems and improve efficiency? How does full-stack liquid cooling solve the challenge of high-density heat dissipation? Answering these questions urgently requires collaborative exploration, technological innovation, and practical implementation across the entire industry chain.

To effectively respond to the needs of industrial development, the 2026 Open AI Infra Summit will be held on April 9-10, 2026 in Beijing. Guided by the Global Computing Consortium (GCC) and hosted by the GCC-Open AI Infra Community, the conference centers on the theme "Open Innovation, Collaborative Win-Win: Building the Intelligent Computing Infrastructure Ecosystem." The event will feature four core dimensions: specification releases, technical seminars, resource aggregation, and ecosystem building. The comprehensive program includes "1 main forum + 6 thematic forums + over 30 featured exhibition points," creating an industry event that integrates cutting-edge exploration, technical exchange, and practical experience sharing, comprehensively supporting the high-quality development of the intelligent computing infrastructure industry.

Major Specifications Debut, Forward-Looking and Practical

In response to the rapid iteration of domestic AI computing scenarios and localization needs, the GCC-Open AI Infra Community promotes collaborative formulation of technical specifications through an open, co-creation open-source community model. Driven by the actual needs of hyperscale users, the community bridges the gap between international specifications and the development of domestic internet users and China's computing industry, making technical specifications both cutting-edge and practical. This conference will feature the major release of a series of community specifications refined from hyperscale user practices. Among them, the GCC Liquid-Cooled Rack-Scale System Architecture Design Specification - Type A, contributed by community member ByteDance, is specifically designed for super-node application scenarios, focusing on the core requirements of high computing density, high-bandwidth interconnect, and centralized power supply. It establishes a dedicated design solution for cold-plate liquid-cooled rack-scale servers, precisely adapting to the hardware deployment needs of AI computing scenarios. Simultaneously, a series of specifications including the AIDC Infrastructure Specification and the GCC DPU Design Specification will be released, building a complete specification system tailored to computing scenarios in the AI era. The release of these specifications will bridge the technical gaps between chip adaptation, infrastructure design, and infrastructure construction, forming a full-link technical collaboration system, clarifying the core direction for technology R&D and industrial implementation for the AI Infra industry, and promoting the high-quality advancement of the computing infrastructure industry.

Hardcore Technological Breakthroughs, Unlocking Computing Evolution Pathways

As the rapid iteration of AI technology places higher demands on the efficiency, scalability, and sustainability of computing infrastructure, the implementation and application of core technologies such as high-density computing, high-speed interconnect, and super-node architecture, along with collaboration across the entire industry chain, have become key to industry breakthroughs. Building on its efforts to promote specification development and implementation, the GCC-Open AI Infra Community has already begun technology prototype validation and other work focused on the evolution of next-generation computing technology pathways. This conference will directly address the core pain points of computing infrastructure in the AI era, bringing together top global industry experts, leading technical figures from major users, and corporate representatives. In-depth discussions will cover the technological evolution from megawatt-scale computing systems to gigawatt-scale data centers, exploring full-link technology integration and application solutions spanning chips, infrastructure architecture, and physical facilities. Participants will collectively examine innovative directions in computing density, architecture, and energy efficiency. Through hardcore technical exchanges and trend exploration, the conference will provide a clear evolutionary path for the R&D and deployment of next-generation computing infrastructure, driving breakthrough advances in computing infrastructure technology to continuously meet the computing demands driven by AI industry growth.

Full-Stack Resource Aggregation, One-Stop Access to Cutting-Edge Developments

With a panoramic layout featuring "1+6" forums combined with over 30 specialized exhibition booths, the conference creates an immersive exchange platform covering the entire computing infrastructure industry chain, enabling comprehensive display and exchange of technologies, products, and case studies. The main forum will focus on the innovative achievements and future development plans of the GCC-Open AI Infra Community, offering in-depth interpretation of the underlying logic of computing industry development through discussions on application implementation by leading users and cutting-edge technology trends. The six thematic forums, chaired by leading users, will center on core topics including super-node high-speed interconnect, 800V HVDC power distribution systems, and new full-stack liquid cooling technologies, facilitating deep technical discussions and experience sharing. More than 30 featured exhibition booths will showcase cutting-edge technologies, innovative products, and implementation cases, allowing attendees to experience industry developments firsthand and promoting technical exchange and achievement sharing across the entire computing infrastructure industry chain.

Panoramic Ecosystem Co-Creation, Connecting the Industry Chain

The prosperity of the computing infrastructure ecosystem depends on collaborative efforts across the entire industry chain. The project groups and project teams of the GCC-Open AI Infra Community serve as the core vehicles for community technical practice, continuously advancing technical specification development and solution implementation, forming a collaborative network that efficiently links demand-side and supply-side stakeholders. By promoting design open-source, open contribution decision-making, and knowledge sharing, the community effectively facilitates the sharing of industrial resources and complementary capabilities. This conference will bring together the entire industry chain, including leading internet users, ICT equipment manufacturers, chip and key component suppliers, and infrastructure service providers, achieving comprehensive aggregation of computing demanders, equipment suppliers, core component manufacturers, and infrastructure service providers. The conference breaks down communication barriers across industry chain segments, establishing an efficient platform for resource matching and exchange, promoting deep integration of technologies, products, and application scenarios, and opening up a full-link collaboration channel from technology R&D to product implementation, and from computing supply to demand adaptation. This will foster resource sharing and complementary advantages across upstream and downstream industry chains, jointly building an open, efficient, and win-win intelligent computing infrastructure ecosystem suited to the AI era.

It is reported that preparations for the 2026 Open AI Infra Summit are progressing in an orderly manner. More conference schedules, details on prominent guests, and seminar content will be announced on the community's public WeChat account. Colleagues from all sectors of the global AI Infra community will gather in Beijing to discuss the innovative development of intelligent computing infrastructure, solidifying the foundation of the artificial intelligence industry through computing power.